The increasing demand for consumer electronics and other industrial applications calls for high-volume PCB fabrication and assembly. It is important to choose a dependable and capable CM to cater to your mass production requirements.
If you’re looking for a circuit board that can withstand higher levels of temperature and stress, then rigid boards can be a good choice.
Rigid circuit boards, as the name implies, are made of hard fiber-glass-based dielectric material. These boards can be found in almost all commercial applications and critical industries such as space, defense, and medical. Rigid PCBs can find their applications in static devices that operate under very high-voltage and high-temperature environments.
Designing an optimum stack-up and layout is critical to fabricating a reliable and cost-effective circuit board. Inappropriate layout can result in various signal integrity issues, such as EMI and crosstalk.
To facilitate an optimal fabrication process, your design should adhere to your CM’s design for manufacturing (DFM) guidelines. In addition to this, you need to provide all the required data, such as Gerbers, ODB++, drill file, netlist, BOM, and so on. You will find the list below on this page.
Early collaboration with your CM can save you time and money by avoiding unnecessary board re-spins. So don’t hesitate to reach out to us if you have any questions.
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
Min Layer Count | 1 | 1 | 1 |
Max Layer Count | 30 | 30 | 30 |
Min Board Thickness | .010” (.254 mm) | .005” (.127 mm) | .005” (.127 mm) |
Max Board Thickness | .250” (6.35 mm) | .250” (6.35 mm) | .250” (6.35 mm) |
Min Core Thickness | .004” (.102 mm) | .002” (.051 mm) | .002” (.051 mm) |
Min Dielectric | .004” (.102 mm) | .003” (.076 mm) | .002″ (.051 mm) |
Min Starting Copper Foil Weight | 9 microns | 9 microns | 5 micron |
Max Finished Copper Thickness (O/L) | 4 oz (118 ml) | 6 oz (177 ml) | 1 oz (30 ml) |
Max Finished Copper Thickness (I/L) | 4 oz (118 ml) | 4 oz (118 ml) | 0.5 oz (15 ml) |
Min Panel Size | 12” x 18” (30 x 46 cm) | 12” x 18” (30 x 46 cm) | 12″ x 18″ (30 x 46 cm) |
Max Panel Size | 12” x 18” (30 x 46 cm) | 21” x 29” (53 x 74 cm) | 18″ x 24″ (46 x 61 cm) |
Smallest Mechanical Drill Diameter | .0059” (.150 mm) | .0059” (.150 mm) | .0059″ (.150 mm) |
Smallest Laser Drill Diameter | .005″ (.127 mm) | .004″ (.102 mm) | .004″ (.102 mm) |
Min Finished Hole Size | .004” (.102 mm) | .002” (.051 mm) | .002″ (.051 mm) |
Max Through Hole Aspect Ratio (depending on board thickness and finish hole) | .010” (.254 mm) | .005” (.127 mm) | .005” (.127 mm) |
Min Board Thickness | 10:1 | 10:1 | 10:1 |
Max Laser Via Aspect Ratio | .75:1 | .75:1 | .75:1 |
Blind Via Finished Hole Size | .004” (.102 mm) | Plated Shut | Plated shut |
Buried Via Finished Hole Size | .004” (.102 mm) | .002” (.051 mm) | .002″ (.051 mm) |
Min Trace and Space | .004” (.102 mm) | .003” (.076 mm) | .002″ (.051 mm) |
Min Pad Size for Test | .005” (.127 mm) | .005” (.127 mm) | .005” (.127 mm) |
Process Pad Diameter | D + .012” (.305 mm) (1-mil (.025-mm) annular ring) | D + .008” (.203 mm) (tangency) | D + .008” (.203 mm) (tangency) |
Stacked Vias | Yes | Yes | Yes |
Min Wire Bond Pad Size | > .006” (.152 mm) | .004” (.102 mm) | .004″ (.102 mm) |
Controlled Impedance Tolerance | 10% | 5% | 5% |
Solder Mask Registration | .002” (.051 mm) | 001” (.025 mm) | .001″ (.025 mm) |
Solder Mask Feature Tolerance | .0015” (.038 mm) | .001” (.025 mm) | .001” (.025 mm) |
Solder Mask Min Dam Size (based on green soldermask color) | .005” (.127 mm) | .004” (.102 mm) | .004” (.102 mm) |
Min Diameter Route Cutter Available | .024” (.610 mm) | .021” (.533 mm) | .021” (.533 mm) |
Routed Part Size Tolerance | .005” (.127 mm) | .003” (.076 mm) | .003″ (.076 mm) |
Laser Hole Location Tolerance | .0005” (.013 mm) | .0005” (.013 mm) | .0005″ (.013 mm) |
Laser Routed Part Size Tolerance ( can only be done with panels .032” thick) | 002” (.051 mm) | 002” (.051 mm) | .001″ (.025 mm) |
Bow and Twist Tolerance | Per IPC spec | Per IPC spec | Per IPC spec |
Thickness Tolerance (based on board thickness) | 10% | 5% | 5% |
Sequential Laminations | 3 or less lamination cycles | 4 lamination cycles | 5 lamination cycles |
Buried Vias | Yes | Yes | Yes |
Blind Vias | Yes | Yes | Yes |
Conductive Filled Vias | Yes | Yes | Yes – Cu plate shut |
Non Conductive Filled Vias | Yes | Yes | Yes |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
HASL (Vertical or Horizontal) | Yes | Yes | No |
Lead Free HASL | Yes | Yes | No |
OSP (Shikoku F2) | Yes | Yes | Yes |
OSP (Entek) | Yes | Yes | Yes |
ENIG (Electroless Nickel/Immersion Gold) | Yes | Yes | Yes |
Immersion Silver | Yes | Yes | No |
Electrolytic Soft Gold | Yes | Yes | Yes |
Electrolytic Hard Gold | Yes | Yes | Yes |
Selective Gold | Yes | Yes | Yes |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
Semi – Glossy | Yes | Yes | Yes |
Glossy | Yes | Yes | Yes |
Matte | Yes | Yes | Yes |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
Green | Yes | Yes | Yes |
Black | Yes | Yes | Yes |
Red | Yes | Yes | Yes |
Blue | Yes | Yes | Yes |
Yellow | Yes | No | No |
White | Yes | No | No |
Clear | Yes | Yes | Yes |
Bright White | Yes | No | No |
Purple | Yes | No | No |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
All Colors | Yes | Yes | Yes |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
Routed Array | Yes | Yes | Yes |
V Score, Edge to Copper | .01” | .007” (.178 mm) | .007″ (.178 mm) |
V Score Angles | 35°, 45°, 60° | 35°, 45°, 60° | 35°, 45°, 60° |
Countersink | Yes | Yes | Yes |
Counterbore | Yes | No | No |
Bevel | Yes | No | No |
Milling | +/- .003” (.076 mm) | +/- .002” (.051 mm) | +/- .001” (.025 mm) |
Edge Castellation | Yes | No | No |
Edge Plating | Yes | No | No |
Heatsinks | No | Yes | No |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
10 Volt | Yes | Yes | Yes |
40 Volt (Burn-In Boards) | Yes | Yes | Yes |
250 Volt | No | Yes | Yes |
500 Volt | No | Yes | Yes |
Hi Pot | No | Yes | Yes |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
Arlon 85NT | No | Yes | No |
Bergquist | No | Yes | No |
Flexible Polyimide | No | Yes | Yes |
Hybrid Constructions | Yes | Yes | Yes |
Isola 370HR | Yes | Yes | Yes |
Isola FR406 | Yes | Yes | Yes |
Isola FR408 HR | Yes | Yes | Yes |
Isola P95 | Yes | Yes | Yes |
Isola P96 | Yes | Yes | Yes |
Iteq IT180 | Yes | Yes | Yes |
Nelco BT N5000 | Yes | Yes | Yes |
Nelco N4000-13 | Yes | Yes | Yes |
Nelco N4000-29 | Yes | Yes | No |
Nelco N7000-2 | Yes | Yes | Yes |
Hi Pot | No | Yes | Yes |
No Flow Prepreg | Yes | Yes | Yes |
Panasonic Megtron | Yes | Yes | Yes |
Panasonic R1755 | Yes | Yes | No |
Panasonic R1766 | Yes | Yes | Yes |
Polyclad Getek | Yes | Yes | Yes |
PSA Bond Film | No | Yes | Yes |
Rogers 3000 Series | Yes | Yes | No |
Rogers R4000 Series | Yes | Yes | No |
Rogers 5000 Series | Yes | Yes | No |
Rogers 6000 Series | Yes | Yes | No |
Rogers TMM | Yes | Yes | No |
Ventec VT47 | Yes | No | No |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
Microsection | Yes | Yes | Yes |
Solderability | Yes | Yes | Yes |
X-Ray Fluorescence | Yes | Yes | Yes |
Ionic Contamination | Yes | Yes | Yes |
Time Domain Reflectometry Test (TDR) | Yes | Yes | Yes |
FAI | Yes | Yes | Yes |
Certificate of Compliance | Yes | Yes | Yes |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
94VO | Yes | Yes | No |
STANDARD | ADVANCED | MICRO | |
---|---|---|---|
MIL-PRF-55110 | Yes | No | No |
MIL-PRF-31032/1 | Yes | No | No |
MIL-PRF-31032/2 | Yes | No | No |
IPC 6012, Class 1, 2 and 3 | Yes | Yes | Yes |
ISO 9001:2015 | Yes | Yes | Yes |
ISO 13485:2016 | Yes | Yes | Yes |