It is crucial to address some of the causes pushing businesses towards the miniaturization of their electronics products in order to properly understand their advantages.
Consumer demand may be the most important factor in this situation. Consider how cellular phones have changed over the past 20 years, going from huge gadgets with simple functions to compact smartphones that can almost do everything. Tablets, laptops, wearables, and whatnots all follow the same pattern.
Then comes the medical industry with its demands for extra small circuits that can enhance and even save the lives of patients. Wristbands, pacemakers, neural probes, camera modules, stimulators, implants… These medtech devices mark an evolution in the healthcare system that now offers more personalized prevention and treatments.
Not only do circuit boards get smaller but they also get denser. For designers, this means packing more input/output on considerably small spaces. A tighter pitch requires very fine trace and space that must meet signal integrity requirements. Of course, as your trace becomes smaller, you want to avoid losing your signal’s energy as subtractive PCB printing techniques at the microscale makes it extremely difficult to guarantee homogeneous traces.
To prevent serious electrical issues and potential failure, designers must reach out to their PCB house to learn about their capabilities. And work hand-in-hand for the best results possible.
PCB Attribute | Sierra Circuits capability |
---|---|
Min Layer Count | 1 |
Max Layer Count | 30 |
Min Board Thickness | .005″ (.127 mm) |
Max Board Thickness | .250″ (6.35 mm) |
Min Core Thickness | .002″ (.051 mm) |
Min Dielectric | .002″ (.051 mm) |
Min Starting Copper Foil Weight | 3 micron (.003 mm) |
Max Finished Copper Thickness (O/L) | .0015″ (.038 mm) |
Max Finished Copper Thickness (I/L) | .001″ (.025 mm) |
Min Panel Size | 12″ x 18″ (30 x 46 cm) |
Max Panel Size | 12″ x 18″ (30 x 46 cm) 1 |
Smallest Mechanical Drill Diameter | .005″ (.127 mm) |
Smallest Laser Drill Diameter | .0025″ (.064 mm) |
Min Finished Hole Size | Min Finished Hole Size |
Max Through Hole Aspect Ratio | > 10:1 |
Max Blind Via Aspect Ratio | .8:1 |
Blind Via Finished Hole Size | Plated shut |
Buried Via Finished Hole Size | .002″ (.051 mm) |
Min Trace and Space | .0015″ (.038 mm) |
Min Pad Size for Test | .003″ (.076 mm) |
Process Pad Diameter | D + .004″ (.102 mm) |
Stacked Vias | Yes |
Min Wire Bond Pad Size | .0025″ (.064 mm) |
Controlled Impedance Tolerance | 5% |
Solder Mask Registration | .001″ (.025 mm) |
Solder Mask Feature Tolerance | .0005″ (.013 mm) |
Solder Mask Min Dam Size | .003″ (.076 mm) |
Min Diameter Route Cutter Available | .021″ (.533 mm) |
Routed Part Size Tolerance | .002″ (.051 mm) |
Laser Hole Location Tolerance | .0005″ (.013 mm) |
Laser Routed Part Size Tolerance – Can only be done with panels < .032” thick | .001″ (.025 mm) |
Bow and Twist Tolerance | Per IPC spec |
Thickness Tolerance | 5% |
Sequential Laminations | > 5 lam cycles |
Buried Vias | Yes |
Blind Vias | Yes |
Conductive Filled Vias | Yes – Cu plate shut |
Non Conductive Filled Vias | Yes |
Surface Finish Type | Sierra Circuits capability |
---|---|
HASL (Vertical or Horizontal) | No |
Lead Free HASL | No |
OSP (Shikoku F2) | Yes |
OSP (Entek) | Yes |
ENIG (Electroless Nickel/Immersion Gold) | Yes |
Immersion Silver | No |
Electrolytic Soft Gold | Yes |
Electrolytic Hard Gold | Yes |
Selective Gold | Yes |
Mask Finish Type | Sierra Circuits capability |
---|---|
Semi – Glossy | Yes |
Glossy | Yes |
Matte | Yes |
Mask Color | Sierra Circuits capability |
---|---|
Green | Yes |
Black | Yes |
Red | Yes |
Blue | Yes |
Yellow | No |
White | No |
Clear | Yes |
Bright White | No |
Purple | No |
Legend Color | Sierra Circuits capability |
---|---|
All Colors | Yes |
Fabrication Technique | Sierra Circuits capability |
---|---|
Routed Array | Yes |
V Score, Edge to Copper | .007″ (.178 mm) |
V Score Angles | 35°, 45°, 60° |
Countersink | Yes |
Counterbore | Yes |
Bevel | Yes |
Milling | +/- .003” (.076 mm) |
Edge Castellation | Yes |
Edge Plating | Yes |
Heatsinks | No |
Test Type | Sierra Circuits capability |
---|---|
10 Volt | Yes |
40 Volt (Burn-In Boards) | Yes |
250 Volt | Yes |
500 Volt | Yes |
Hi Pot | Yes |
Material Type | Sierra Circuits capability |
---|---|
Very Thin Film | Yes |
Arlon 85NT | No |
Bergquist | No |
Hybrid Constructions | Yes |
Isola FR406 | Yes |
Isola FR408 HR | Yes |
Isola P95 | Yes |
Isola P96 | Yes |
Iteq IT180 | Yes |
Panasonic R1766 | Yes |
Panasonic R1755 | no |
Panasonic Megtron | No |
Nelco N4000-13 | Yes |
Nelco N4000-29 | No |
Nelco BT N5000 | Yes |
Nelco N7000-2 | Yes |
No Flow Prepreg | Yes |
Isola 370HR | Yes |
Polyclad Getek | Yes |
PSA Bond Film | Yes |
Rogers 3000 Series | No |
Rogers R4000 Series | No |
Rogers 5000 Series | No |
Rogers 6000 Series | No |
Rogers TMM | No |
Available Reports | Sierra Circuits capability |
---|---|
Microsection | Yes |
Solderability | Yes |
X-Ray Fluorescence | Yes |
Ionic Contamination | Yes |
Time Domain Reflectometry Test (TDR) | Yes |
FAI | Yes |
Certificate of Compliance | Yes |
Certification | Sierra Circuits capability |
---|---|
94VO | No |
Classification | Sierra Circuits capability |
---|---|
MIL-PRF-55110 | No |
MIL-PRF-31032/1 | No |
MIL-PRF-31032/2 | No |
IPC 6012, Class 1, 2 and 3 | Yes |
ISO 9001:2015 | Yes |
ISO 13485:2016 | Yes |